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PCB Assembly – Execution Excellence

From their conception by Thomas Edison and Albert Hanson in the early 1900’s, it took nearly 50 years for Printed Circuit Boards (PCB’s) to become common in electronics.  The transformation from those early boards to current offerings has been nothing short of revolutionary.  With these advances in materials and capabilities have come increases in product capability and component density.  BEI’s manufacturing processes are continuously evolving to meet the technological needs of our customers and the products we manufacture for them.

Circuit Board

Assembly Options

  • Lead-Free or Leaded
  • Water Washable or No-Clean Pastes / Fluxes
  • Chip Epoxy

Surface Mount Assembly

  • Three high speed assembly lines
  • DEK Stencil Printers w/ Quik-Tool Supports
  • Aqueous Tech SW-CLR Stencil Washer
  • Universal Advantis AC-30S Chip Shooter & AX-7S Flex Placer
  • Fuji CP Chip Shooters & QP/XP Flex Placers
  • Chips, SOTs, SOICs, PLCCs, LCCs, QFPs, BGAs, QFNs
  • Sizes from 0201 to 150mm on 4-102mm Tape or Waffle Trays
  • Offline Feeder Setup
  • PMD System for Component Verification and Process Monitoring
  • In-House Q-Corporation Tape & Reel
  • Speedline & Conceptronics Ovens
  • Mirtec MV-2 & MV-3 AOIs
  • Direct Part Printing Process
  • VJ Electronix Summit 750 BGA Station

Through Hole Assembly

  • Customer Based Production Cells
  • Universal VCD Axial Insertion
  • Zierick Terminal Insertion
  • GPD, Hakko, & Custom Lead Forming Equipment
  • Vitronics & Electrovert Wave Solder
  • Pillarhouse Selective Soldering
  • Hakko Solder Fountains